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 STPS3L40
Power Schottky rectifier
Main product characteristics
A
IF(AV) VRRM Tj (max) VF(max)
3A 40 V 150 C 0.44 V
K
SMC STPS3L40S
Features and Benefits

A
Negligible switching losses Low thermal resistance Low forward voltage drop Avalanche capability specified
K
SMB flat STPS3L40UF
Description
Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. Packaged in SMC, and low profile SMB, this device is intended for use in DC/DC chargers. Table 1.
Symbol VRRM IF(AV) IFSM PARM Tstg Tj
1.
dPtot --------------dTj
Order codes
Part Number STPS3L40S STPS3L40UF Marking S3L4 FS3L4
Absolute Ratings (limiting values)
Parameter Repetitive peak reverse voltage SMC Average forward current SMB flat Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Operating junction temperature (1) TL = 120 C = 0.5 TL = 130 C = 0.5 tp = 10 ms sinusoidal tp = 1 s Tj = 25 C Value 40 3 75 1300 -65 to + 175 150 Unit V A A W C C
<
1 ------------------------Rth ( j - a )
condition to avoid thermal runaway for a diode on its own heatsink
February 2007
Rev 3
1/8
www.st.com 8
Characteristics
STPS3L40
1
Characteristics
Table 2.
Symbol Rth(j-l) Junction to lead SMB flat 10
Thermal resistance
Parameter SMC Value 18 C/W Unit
Table 3.
Symbol IR(1)
Static electrical characteristics
Parameter Reverse leakage current Test Conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Typ. Max. 100 16 40 0.5 IF = 3 A 0.40 0.44 V 0.62 IF = 6 A 0.52 0.58 Unit A mA
VF(1)
Forward voltage drop
Tj = 125 C Tj = 25 C Tj = 125 C
1. Pulse test: tp = 380 s, < 2%
To evaluate the conduction losses use the following equation: P = 0.30 x IF(AV) + 0.047 IF2(RMS) Figure 1.
PF(AV)(W)
2.0 3.5
Average forward power dissipation Figure 2. versus average forward current
IF(AV)(A)
= 0.1 = 0.2 = 0.5
3.0
Average forward current versus ambient temperature ( = 0.5) - SMC
Rth(j-a)=Rth(j-l)
SMC
1.6
= 0.05 =1
2.5
Rth(j-a)=75C/W
1.2
2.0 1.5 1.0
0.8
0.4
T
0.5
T
IF(AV)(A)
0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0
=tp/T
3.5
tp
0.0 4.0 0
=tp/T
25
tp
50
Tamb(C)
75 100 125 150
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STPS3L40
Characteristics
Figure 3.
Average forward current versus ambient temperature ( = 0.5) SMB flat
Rth(j-a)=Rth(j-l)
Figure 4.
Non repetitive surge peak forward current versus overload duration (maximum values) SMC
SMC
IF(AV)(A)
3.5 3.0 2.5
Rth(j-a)=75C/W SMB flat
IM(A)
14 12 10
Ta=25C
2.0 1.5 1.0
8 6 4
Ta=75C
T
IM
Ta=125C
0.5 0.0 0
2
=tp/T
25
tp
50
Tamb(C)
0 75 100 125 150 1.E-03
t
=0.5
t(s)
1.E-02 1.E-01 1.E+00
Figure 5.
Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat
SMB flat (non exposed pad)
Figure 6.
Normalized avalanche power derating versus pulse duration
IM(A)
45 40 35 30
PARM(tp) PARM(1s)
1
0.1
25 20 15 10 5 0 1.E-03 1.E-02 1.E-01 1.E+00
TL=125C
IM t
TL=25C TL=75C
0.01
=0.5
t(s)
0.001 0.01 0.1 1
tp(s)
10 100 1000
Figure 7.
Normalized avalanche power derating versus junction temperature
Figure 8.
Relative variation of thermal impedance junction to ambient versus pulse duration - SMC
PARM(tp) PARM(25C)
1.2 1
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7
SMC
0.8 0.6 0.4 0.2
0.6 0.5 0.4 0.3 0.2
T
Single pulse
Tj(C)
0 25 50 75 100 125 150
0.1 0.0 1.E-02 1.E-01 1.E+00
tp(s)
1.E+01
=tp/T
1.E+02
tp
1.E+03
3/8
Characteristics
STPS3L40
Figure 9.
Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat
Figure 10. Reverse leakage current versus reverse voltage applied (typical values)
IR(mA)
1.E+02
Zth(j-l)/Rth(j-l)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 1.E-01 1.E+00
SMB flat
1.E+01
Tj=125C
Tj=100C
Tj=25C
0.2
Single pulse
1.E-02
0.1 0.0 1.E-04 1.E-03 1.E-02
tp(s)
1.E-03 1.E-01 1.E+00 1.E+01 0 5 10 15
VR(V)
20 25 30 35 40
Figure 11. Junction capacitance versus reverse voltage applied (typical values)
C(pF)
1000
F=1MHz VOSC=30mVRMS Tj=25C
Figure 12. Forward voltage drop versus forward current
IFM(A)
100
10
Tj=125C (maximum values)
Tj=125C (typical values)
100
1
Tj=25C (maximum values)
0
VR(V)
10 1 10 100 0 0.0 0.1 0.2 0.3 0.4
VFM(V)
0.5 0.6 0.7 0.8 0.9 1.0
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35m)
Rth(j-a)(C/W)
110 100 90
SMC
80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB flat
SCU(cm)
FIG 15A - WITHOUT EXPOSED PAD
4/8
STPS3L40
Package Information
2
Package Information
Epoxy meets UL94,V0 SMC package mechanical data
Dimensions Ref
E1
Table 4.
Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.40
Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063
A
D
1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75
A2 b
E
c E
A1
E1
C A2 E2 L b
E2 D L
Figure 14. SMC footprint (dimensions in mm)
1.54 5.03 1.54
3.15
8.11
5/8
Package Information Table 5. SMB Flat dimensions
Dimensions Ref.
A c D L L2 E E1 L L1 b
STPS3L40
Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029
Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024
A b(1) c
(1)
0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60
1.10 2.20 0.40 3.95 5.60 4.60 1.50
D E E1 L L1 L2
1. Applies to plated leads
Figure 15. SMB Flat footprint (dimensions in mm)
5.84
2.07
1.20
3.44
1.20
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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STPS3L40
Ordering information
3
Ordering information
Ordering type STPS3L40S STPS3L40UF Marking S3L4 FS3L4 Package SMC SMB flat Weight 0.24 g 0.50 g Base qty 2500 5000 Delivery mode Tape and reel Tape and reel
4
Revision history
Date Jul-2003 08-Feb-2007 Revision 2A 3 Last update. Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Description of Changes
7/8
STPS3L40
Please Read Carefully:
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